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Data Sheet
XFP Optical Transceivers for 10km 10G Datacom and Storage Applications IGF Series IGF-17311J
Features: The Bookham IGF Series optical transceiver modules are high-performance, cost-effective modules for serial optical data communication applications at 10Gb/s. They are designed to provide 10Gb/s Ethernet and 10Gb/s Fiber Channel 10 km compliant links. The modules are designed for single mode fiber and operate at a nominal wavelength of 1310nm. They incorporate Bookham's exclusive optical packaging platform. The modules aid system hardware engineers in implementing low-cost single mode Physical Media Dependency (PMD) solutions that are protocol transparent. The "hot pluggable" feature built into every module reduces manufacturing cost, inventory costs and allows optical port upgrades at the customer premises. Built-in remote monitoring via digital diagnostics allows user access to static and dynamic data as well as module condition. The IGF-17311J uses a DFB laser packaged in conjunction with an optical isolator. This design provides for maximum eye opening, minimized jitter generation, and excellent back reflection performance. The transmitter is fully EN/IEC60825-1 Class 1/Class I laser eye safety compliant. * Multi-Protocol support: IEEE 802.3ae 10G Ethernet 10GBASE-LR/LW 10G Fibre Channel 1200-SM-LL-L * Compliant with the XFP * 9.95 to 10.52 Gb/s data rates * Supports 10km link distances * Hot Pluggable * Low EMI for high port density * 2.2W Typical Power Dissipation * On board Enhanced Digital Diagnostics providing I2C remote monitoring capability * XFI Loop-Back Diagnostic * Integral Signal Conditioning ICs enabling FR4 host board PCB traces up to 8 inches * Duplex LC connector * Transmit disable and loss-of-signal functions * RoHS compliant
Applications: * High Port Density Solutions * 10GBASE-L applications * 10Gb/s Gigabit Ethernet Networking * Datacom and Storage-area networking * Rack-to-rack connectivity * Client side interconnection * Fiber to the X aggregation
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Data Sheet
Absolute maximum ratings
Parameter Storage Temp Supply voltage 5 Supply voltage 3 Supply voltage 2 Supply voltage E5 Data AC volt. differential Data DC volt Receiver Input Damage Threshold Symbol Tstg VCC5 VCC3 VCC2 VEE5 Tx+, TxTx+, TxPDamage Min -40 0 0 1.8V Not required -5.2V Not required -0.5 0 2 VCC2 5 Max 85 6 4.0 Units C V V V V Vpp Vpp dBm
Recommended operating conditions
Parameter Baud rate Supply voltage 5 Supply current 5 Supply voltage 3 Supply current 3 Supply voltage 2 Supply voltage
E5
Symbol
Min 9.95
Typ
Max 10.52
Units GBd V mA V mA V V
Notes 10 GbE; 10G FC +/- 5%
VCC5 ICC5 VCC3 ICC3 VCC2 VEE5 Pw Ts1
4.75
5.0 275
5.25 400 3.47 300
3.13
3.3 255 1.8 -5.2 2.2
+/- 5%
Not required Not required
Power dissipation Temperature case
2.7 70
W C
0
Please contact sales for special requirements
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Data Sheet
Operating Specifications - electrical
Parameter CML input (differential) CML output (differential) Rise/Fall time Low Speed Electrical Signals Output voltage high Output voltage low Input voltage high Input voltage low Loss of signal timing Assert (off to on) Deassert (on to off) TA TD 100 100 s s VOH VOL VIH VIL VCC3-0.5 0 2 0 VCC3+0.3 0.4 VCC3+0.3 0.8 V V RX_LOS, MOD_NR, Interrupt TX_DIS, P_Down/RST Symbol Min VTxDiff VRxDiff Tr/Tf 125 360 24 Value Typical Units Max 940 770 mVpp mVpp Ps 100 ohm differential 100 ohm differential 20% - 80% Notes
Transmitter operating specifications - optical
Parameter Center wavelength Optical transmit power Transmitter Optical Modulation Amplitude Transmitter power (in OMA) - TDP Side mode suppression Extinction ratio Transmitter and dispersion penalty TX disabled output power Output optical eye SMSR ER TDP POFF Symbol Min c Po OMA 1260 -6.0 -5.2 -6.2 30 3.5 3.2 -30 Compliant with IEEE 802.3ae clause 52 Value Typical 1310 Units Max 1355 0.5 nm dBm dBm dBm dB dB dB dBm 10km SMF EOL Notes
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Data Sheet
Receiver operating specifications - optical
Parameter Input operating wavelength Receiver sensitivity Receiver sensitivity in OMA Stressed receiver sensitivity in OMA Receiver overload Reflectance Loss of Signal Loss of Signal Assert (Off to On) Loss of Signal Deassert (On to Off) Hysteresis PA PD PA - PD 0.5 -32 -20 -15 6 dBm dBm dB Symbol Min PIN-MIN PIN-OMA SRS PIN-MAX 0.5 -12 1260 -17 -12.6 -10.3 Value Typical Units Max 1360 nm dBm dBm dBm dBm dB Ave. power Ave. power at ER=6dB Notes
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Data Sheet
Electrical pin out
Top of Board
GND 16 GND 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 Rx_LOS 17 RDMod_NR 18 RD+ Mod_Abs 19 GND SDA 20 VCC2 SCL 21
P_down/RST
15 14 13 12 11 10 9 8 7 6 5 4
1 GND 2 VEE5 3 Mod_Desel 4 Interrupt 5 TX_DIS 6 VCC5 7 GND 8 VCC3 9 VCC3 10 SCL 11 SDA 12 Mod_Abs 13 Mod_NR 14 Rx_LOS 15 GND
GND TD+ TDGND GND RefCLKRefCLK+ GND VCC2
P_down/RST
VCC3 22 VCC2 VCC3 23 GND GND 24 RefCLK+ VCC5 25 RefCLKTX_DIS 26 GND Interrupt 27 GND
VCC2 GND RD+ RDGND
Mod_Desel 3 28 TDVEE5 29 TD+ GND 30 GND 1 2
Towards Bezel
Towards ASIC
Figure 1: XFP Module Board Pinout & Names
Figure 2: Host PCB XFP Pinout Top View
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Data Sheet
Pin definitions
Pin # 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 CML-O CML-O LVTTL-I LVTTL-I/O LVTTL-O LVTTL-O LVTTL-O LVTTL-I LVTTL-O LVTTL-I Logic Symbol GND VEE5 Mod_Desel Interrupt TX_DIS VCC5 GND VCC3 VCC3 SCA SDA Mod_Abs Mod_NR RX_LOS GND GND RDRD+ GND VCC2 Function Module Ground; Signal Ground Optional -5.2V Power Supply--NOT USED Module De-select; When held low by host allows the module to respond to 2-wire serial interface commands Interrupt_BAR; Indicates the presence of an important condition that can be read over the two wire interface Transmitter Disable; Turns Off Transmitter Laser Source +5 V Power Supply Module Ground; Signal Ground +3.3 V Power Supply +3.3 V Power Supply Two Wire Interface Clock Two Wire Interface Data Line Indicates Module Not Present; Grounded in Module Module Not ready or Indicating Module Operational Fault Receiver Loss of Signal Indicator Module Ground; Signal Ground Module Ground; Signal Ground Receiver Inverted Data Output Receiver Non-Inverted Data Output Module Ground; Signal Ground +1.8 V Power Supply Power down; When high, places the module in the low power standby mode of less than 1.5 W with 2-wire interface still operational. Reset; The falling edge of P_Down/RST initiates a complete module reset including the 2-wire interface. +1.8 V Power Supply Module Ground; Signal Ground Reference Clock Non-Inverted Input, AC coupled on Host Board Reference Clock Inverted Input, AC coupled on Host Board Module Ground; Signal Ground Module Ground; Signal Ground Transmitter Inverted Data Input Transmitter Non-Inverted Data Input Module Ground; Signal Ground Plug Seq 1 2 3 3 3 2 1 2 2 3 3 3 3 3 1 1 3 3 1 2 1 2 2 2 2 2 1 1 1 2 Notes 1
21
LVTTL-I
P_down/RST
3
22 23 24 25 26 27 28 29 30
Notes:
VCC2 GND PECL-I PECL-I RefCLK+ RefCLKGND GND CML-I CML-I TDTD+ GND
2 1 3 3 1 1 3 3 1 1 1 1 1
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1. Module ground pins are isolated from the module case and chassis ground within the module. 2. Open Collector should be pulled up with 4.7K-10Kohms to a voltage between 3.15V and 3.6V on the host board.
Data Sheet
Figure 3. Host Board Supply Filtering
Figure 4. Host Board mechanical layout (mm)
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Data Sheet
Mechanical interface
The XFP module is a pluggable module with its foundation based on the successful SFP package configuration. It consists of a rectangular package that is approximately 18mm wide and 78mm long. The module interface is a 30 lead connector. The module is inserted into a metal cage assembly. As an option, a heat sink can be clipped to the cage to enhance the cooling of the module.
Figure 5. Example of clip-on heat sink
Thermal interface
One of the unique features of the XFP module is that the module cage is designed with the ability to have a thermal heat sink clipped onto the cage. Thus the equipment manufacturer that designs with the XFP can select a heat sink that is optimized for the particular environmental conditions of vertical space above module, air flow, air flow direction and desired pressure drop.
Figure 6. Mechanical Dimensions (mm) of the XFP module.
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Data Sheet
Figure 7. Interface Design with Bezel (mm)
Management Interface
Digital diagnostics is an available interface on all Bookham XFP transceivers. A 2-wire Serial ID interface provides user access to vendor/module identification, customer specific data, link type, static and dynamic monitor hooks, and a check code mechanism for verifying accuracy in the data registers. These "static" and "dynamic" diagnostics allow users to remotely and accurately identify modules and their vendors, make determinations about its compatibility with the system, verify which "Enhanced" diagnostics are supported, and monitor module parameters to determine the module and link condition. The module's "Enhanced Digital Diagnostics" features provide real-time monitoring of receiver input power, transmitter power, internal module temperature, laser bias current, and supply voltage parameters. The 2-wire serial ID interface was originally defined by the GBIC (GigaBit Interface Converter) and SFF-8472 specifications. The XFP MSA (Multi-Source Agreement) document further defined the diagnostics features and introduced a new memory map of the diagnostic information. This interface is a 2-wire interface that allows read-only access to separate memory locations. The memory location starting at A0h (data address 0 ~ 127) contains the Digital Diagnostic Functions. The normal 256 Byte I2C address space is divided into lower and upper blocks of 128 Bytes. The lower block of 128 Bytes is always directly available and is used for the diagnostics and control functions that must be accessed repeatedly. One exception to this is that the standard module identifier Byte defined in the GBIC and SFP is located in Byte 0 of the memory map (in the diagnostics space) to allow software developed for multiple module types to have a common branching decision point. This Byte is repeated in the Serial ID section so that it also appears in the expected relationship to other serial ID bits. Multiple blocks of memories are available in the upper 128 Bytes of the address space. These are individually addressed through a table select Byte which the user enters into a location in the lower address space. Thus, there is a total available address space of 128 * 256 = 32Kbytes in this upper memory space. The upper address space tables are used for less frequently accessed functions such as serial ID, user writable EEPROM, reserved EEPROM and diagnostics and control spaces for future standards definition, as well as ample space for vendor specific functions. These are allocated as follows: * Table 01h: Serial ID EEPROM * Table 02h: User writable EEPROM The details of each memory space are found in the XFP MSA specification Chapter 5. Reference Documents: 1. XFP MSA revision 4.0 found at www.xfpmsa.org; April 13, 2004
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Data Sheet
Regulatory compliance
Bookham IGF-17311J 1310nm XFP transceivers are designed to be Class I Laser compliant. They are certified per the following standards: Feature Agency FDA/CDRH Laser Safety TUV Standard CDHR 21(J) CFR 1040.10 IEC/EN 60950-1:2001 IEC/EN 60825-1/A2:2001 CAN/CSA-60825-1-03 Product Safety UL/CSA UL 60950-1:2003 UL 94 V-0 CAN/CSA-C22.2 No.60950-1-03 MIL-STD 883 Method 3015 IEC61000-4-2 Part 15 Class B FCC/89/336/EE EMI [EU Directive] EN55022, EN55024 Class B 73/23/EEC (Low voltage) 89/336/EEC (EMC) Pass Pass Certificate/Comments 0212646-01 DE3-54632 U8V 06 06 54880 002 U8V 06 06 54880 002
ESD
IEC
Pass
CE
EU Directive
Pass
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Data Sheet
RoHS Compliance
Bookham is fully committed to environment protection and sustainable development and has set in place a comprehensive program for removing polluting and hazardous substances from all of its products. The relevant evidence of RoHS compliance is held as part of our controlled documentation for each of our compliant products. RoHS compliance parts are available to order, please refer to the ordering information section for further details.
Ordering Information: IGF-17311J TRX 10G XFP 10KM SR GBE COM ROHS 5/6
Contact Information
North America Bookham Worldwide Headquarters
2584 Junction Ave. San Jose CA 95134 USA * Tel: +1 408 919 1500 * Fax: +1 408 919 6083
Europe Paignton Office
Brixham Road Paignton Devon TQ4 7BE United Kingdom * Tel: +44 (0) 1803 66 2000 * Fax: +44 (0) 1803 66 2801
Asia Shenzhen Office
2 Phoenix Road Futian Free Trade Zone Shenzhen 518038 China * Tel: +86 755 33305888 * Fax: +86 755 33305805 +86 755 33305807
Important Notice Performance figures, data and any illustrative material provided in this data sheet are typical and must be specifically confirmed in writing by Bookham before they become applicable to any particular order or contract. In accordance with the Bookham policy of continuous improvement specifications may change without notice. The publication of information in this data sheet does not imply freedom from patent or other protective rights of Bookham or others. Further details are available from any Bookham sales representative.
www.bookham.com sales@bookham.com
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BH13280 Rev 1.0 January 2007 (c)Bookham 2005. Bookham is a registered trademark of Bookham Inc.

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